Thick film substrates and blocks
including thru-hole, (through-hole),
wraparound, via fill and multi-layers
(conductor and dielectric) |
| Thin film metallisation |
| Laser diode mounts |
| Photodiode mounts |
| Chip mounts |
| Back facet monitor blocks |
| Bonding blocks |
| Angled blocks |
| Jumpers, jumper blocks |
| Wire bond standoffs |
| Pre-soldered blocks and mounts |
| Mounting blocks with solder pads |
| Cooler spacers |
| Ceramic spacers |
| Ceramic wedges |
| Back lockers |
| Front lockers |
| |
|
Package construction
Front end opto package builds
(installation of selfocs,
thermo-electric coolers,
jumpers etc) |
| Chip on carrier |
| Chip on board |
| Fibre alignment components |
| Fibre tubes |
| Hypo tubes |
| Fibre ferrules |
| Fibre clamps |
| Lens holders |
| Lens carriers |
| Device lenses |
| Miniature lens grinding |
| Package ring frames |
| Package window lids |
| Feedthroughs |
| Pinseals |
| |
|
| Hybrid ceramic substrate circuits |
| Charged coupled device packages |
| Sapphire windows |
| Diced glass shims |
| Special solder pre-forms |
Assemblies using TO style headers
and cans such as TO46, TO18
and TO5 |
| Soldered assemblies |
| Brazed assemblies |
| Reclaimed packages |
| Laser heatsinks |
| Laser array heatsinks |
| Diode array heatsinks |
| Heatsinks |
| Submounts |
|
