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Soldering
Various solders can be used to create assemblies,
enabling lower temperature soldering to
take place. The solders include Sn/Pb, Sn/Pb/Ag
and higher temperature versions such as
Au/Sn and Au/Ge. Miniature solder pads can
be pre-placed ready for subsequent assembly.
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Package
construction
Hermetic package fabrications can be constructed
using various heatsinks of weldable or expansion
controlled alloys. Using soldering, brazing,
glassing or epoxy bonding, discrete electrical
or other feedthroughs can be added.
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Brazing
Where high joint strength or high sub
assembly temperatures are required, metal
and ceramic components can be brazed with
a variety of materials with melting points
>600°C in a protective atmosphere.
Typically Ag/Cu Eutectic (780°C mp)
would be used.
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